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《第三代半导体产业发展现状及机遇挑战》课程介绍

2023-06-09审核人:(已浏览)

授课教师:杨森

教师简介(中英文):

晟光硅研联合创始人,IEEE Member,硕士毕业于西安电子科技大学微电子专业,西安交通大学微电子专业博士,中国宽禁带功率半导体及应用产业联盟青年专家委员会副主任,西安电子科技大学微电子学院特聘创业导师,获评陕西省金牌技术经理人,2022年张家港市领军人才。

参编《半导体材料国家标准汇编》《第三代半导体调研白皮书行家说》并发行,发表SCI论文2篇,发明专利30余项;2013年创办江苏天晟永创,同时组建了公司销售团队,销售公司自主研发产品的同时负责公司融资事宜;长期从事 Tech VC 领域投资。

Sen Yang is the co-founder of Shengguang Silicon Research, IEEE Member, graduated from Xidian University of Electronic Science and Technology with a master's degree in microelectronics, Xi'an Jiaotong University with a doctorate in microelectronics, deputy director of the Youth Expert Committee of China Wide Band Power Semiconductor and Application Industry Alliance, special entrepreneurial mentor of Xidian University of Electronic Science and Technology Microelectronics College, awarded the gold medal technical manager of Shaanxi Province, and the leading talent of Zhangjiagang City in 2022.

He participated in the compilation of "Compilation of National Standards for Semiconductor Materials" and "Third Generation Semiconductor Research White Paper Expert Says" and issued. He has published 2 SCI papers and more than 30 invention patents. In 2013, he founded Jiangsu Tiansheng Yongchuang and set up a sales team to sell the company's self-developed products while being responsible for the company's financing; he has been engaged in long-term investment in the field of Tech VC.

课程简介(中英文):

从第三代半导体产业发展入手,分析国际产业链发展历史、产业发展结构及国内三代半产业发展特点及挑战,深入讲解三代半产业全球布局分工,并以第三代半导体产业链各个分工(衬底、外延、器件)的各自特点属性,开展16个学时细分领域课程:涵盖碳化硅/氮化镓单晶材料生长、晶体切磨抛工艺、同质/异质外延生长、微波/功率器件设计等,帮助学生不仅仅能够从整个产业链分时课程中体会第三代半导体应用的必要性和迫切性,与此同时熟悉各环节关键工艺及发展瓶颈工艺,更好的为未来就业开拓视野。

This course starts with the development of the third-generation semiconductor industry, analyzes the history of the development of the international industry chain, the structure of industry development and the characteristics and challenges of the development of the domestic three-and-a-half-generation industry, explaines in depth the global layout of the three-and-a-half-generation industry division of labor, and the respective characteristics and attributes of each division of the third-generation semiconductor industry chain (substrate, epitaxy, devices). The course contains 16 courses in field subdivided fields : covering silicon carbide/gallium nitride single crystal material growth, crystal cutting, grinding and polishing processes, homogeneous/heterogeneous epitaxial growth, microwave/power device design, etc. and helps students not only to experience the necessity and urgency of third-generation semiconductor applications from the time-sharing course of the entire industry chain, but also to be familiar with the key processes and development bottleneck processes in each link, so as to better expand their horizons for future employment.

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