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Effectiveness of p plus Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications

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Affiliation of Author(s):微电子学院

Title of Paper:Effectiveness of p plus Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications

Journal:IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

First Author:Yin, Xiangkun^Zhu, Zhangming^Yang, Yintang^Ding, Ruixue

Indexed by:Article

Document Code:SCI WOS:000384067100015

Volume:26

Issue:9

Page Number:687-689

ISSN No.:1531-1309

Translation or Not:no

Date of Publication:2016-01-01

Included Journals:SCI

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