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Affiliation of Author(s):微电子学院

Title of Paper:Simulation and analysis on thermal resistance and performance degradation of PiN power diode with 4H-SiC material

Journal:Materials Research Innovations

First Author:Zhang, Y. ; Li, J. ; Zhang, Y.

Document Code:EI 20154801625632

Volume:19

Page Number:448-452

Translation or Not:no

Date of Publication:2015-01-01

Included Journals:EI