一种面向三维集成电路无冗余TSV的编码分级修复方法
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Disigner of the Invention:张军琴,宋仁浩,朱占旗,单光宝,李国良,杨银堂
Type of Patent:Invent
State of Patent:Authorized patents
Authorization number:CN202310449803.4
Service Invention or Not:no
Authorization Date:2023-06-02
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Disigner of the Invention:张军琴,宋仁浩,朱占旗,单光宝,李国良,杨银堂
Type of Patent:Invent
State of Patent:Authorized patents
Authorization number:CN202310449803.4
Service Invention or Not:no
Authorization Date:2023-06-02