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辛菲
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Lecturer graduate teacher
Paper Publications
[1]Study on cavitation, warpage deformation, and moisture diffusion of sop-8 devices during molding process.Micromachines.2023,14(12):2175
[2]Fei Xin.Experimental investigation on the active thermal management of grooved flat heat pipe under the electrohydrodynamic effect.International Communications in Heat and Mass Transfer.2023,141:106604
[3]Fei Xin.A review on thermal properties of hydrogels for electronic devices applications.Gels.2023,9(1):7(1-31)
[4]Fei Xin.Three-Dimensional Numerical Analysis of Mini-Grooved Flat Heat Pipe Filled with Different Working Fluids with Experimental Validation.Heat Transfer Engineering.2023,44(4):317-333
[5]Fei Xin.Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling.Journal of Thermal Analysis and Calorimetry.2022,147(24):14859-14872
[6]Fei Xin.Visualization and Heat Transfer Performance of Mini-Grooved Flat Heat Pipe Filled with Different Working Fluids.Micromachines.2022,13(8):1341(1-16)
[7]Hydrogen Storage Performance of gamma-Graphdiyne Doped Li Based on First Principles for Micro/Nano.Micromachines.2022,13(4)
[8]Fei Xin.Electrohydrodynamic mini flat heat pipe for advanced electronics cooling.Interfacial Phenomena and Heat Transfer.2021,9(1):43-59
[9]陶瓷柱栅阵列封装器件回流焊工艺仿真.电子与封装.2021,21(11)
[10]铜带缠绕型焊柱装联结构的植柱工艺参数优化.电子与封装.2021,21(12)
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