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A review on thermal properties of hydrogels for electronic devices applications

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Title of Paper:A review on thermal properties of hydrogels for electronic devices applications

Journal:Gels

All the Authors:Qiang Lyu

First Author:Fei Xin

Indexed by:Review

Volume:9

Issue:1

Page Number:7(1-31)

Translation or Not:no

Date of Publication:2023-02-07

Included Journals:SCI

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