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Title of Paper:铜带缠绕型焊柱装联结构的植柱工艺参数优化

Journal:电子与封装

All the Authors:刘美君,辛菲,张国光,陈逸睎

Indexed by:Journal paper

Correspondence Author:田文超

Volume:21

Issue:12

Translation or Not:no

Date of Publication:2021-11-01