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电子封装结构设计

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Publisher:西安电子科技大学出版社

Supported By:西安电子科技大学教材和研究生精品立项教材资助

The First Author's Name:田文超,刘焕玲,张大兴

Type of Works:Teaching material

Classification of Disciplines:Engineering

ISBN No.:9787560642369

Translated or Not:no

Date of Publication:2017-04-01

Pre One:微机电技术

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