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个人信息：Personal Information
研究员
性别：男
出生日期：1977-04-09
毕业院校：西安微电子技术研究所
学历：博士研究生毕业
学位：工学博士学位
在职信息：在岗
所在单位：微电子学院
入职时间：2018-03-26
学科：集成电路系统设计 微电子学与固体电子学
扫描关注
1．集成芯粒（chiplet）设计
2．集成芯粒/微系统智能化设计3. 可重构射频微系统/电路设计
- High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling.IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
- Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints.IEEE TRANSACTIONS ON ELECTRON DEVICES
- 单光宝.Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems.MICROMACHINES
- Design of Spectrum Processing Chiplet Based on FFT Algorithm.MICROMACHINES
- 单光宝.Thermodynamic Multi-Field Coupling Optimization of Microsystem Based on Artificial Intelligence.MICROMACHINES
- A brief review of FEM simulation techniques for IC packaging under impact load.2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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