location: Current position: Home >> Scientific Research >> Paper Publications

Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV)

Hits:

Title of Paper:Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV)

Place of Publication:IEICE Electronics Express

Indexed by:Journal paper

Translation or Not:no

Next One:Electromagnetic modeling and analysis of the tapered differential through glass vias

Baidu
map