刘晓贤
个人信息:Personal Information
教授 博士生导师 研究生导师
性别:女
毕业院校:西安电子科技大学
学历:博士研究生毕业
学位:工学博士学位
在职信息:在岗
所在单位:微电子学院
入职时间:2015-11-20
学科:集成电路系统设计 微电子学与固体电子学
办公地点:西安电子科技大学北校区东大楼416室
联系方式:029-88202550
电子邮箱:
扫描关注
- [1]Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.IEICE Electronics Express
- [2]Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips.Journal of Semiconductors
- [3]Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.IEICE Electronics Express
- [4]Electical models of through silicon vias and silicon-based devices for millimeter-wave application.International Journal of RF And Microwave Computer-aided Engineering
- [5]Electrical modeling and analysis of differential dielectric-cavity through-silicon vias array.IEEE Microwave and Wireless Components Letters
- [6]Wideband substrate integrated waveguide bandpass filter based on 3-D ICs.IEEE Trans. on Components, Packaging and Manufacturing Technology
- [7]Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs).IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS.2016,26 (2):89-91
- [8]A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications.IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS.2015,25 (8):493-495
- [9]Parasitic Inductance of Non-Uniform Through-Silicon Vias (TSVs) for Microwave Applications.IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS.2015,25 (7):424-426
- [10]Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits.CHINESE PHYSICS B.2016,25 (11)
|