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刘晓贤

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Professor Supervisor of Doctorate Candidates graduate teacher

Paper Publications

[1]Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.IEICE Electronics Express
[2]Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips.Journal of Semiconductors
[3]Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.IEICE Electronics Express
[4]Electical models of through silicon vias and silicon-based devices for millimeter-wave application.International Journal of RF And Microwave Computer-aided Engineering
[5]Electrical modeling and analysis of differential dielectric-cavity through-silicon vias array.IEEE Microwave and Wireless Components Letters
[6]Wideband substrate integrated waveguide bandpass filter based on 3-D ICs.IEEE Trans. on Components, Packaging and Manufacturing Technology
[7]Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs).IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS.2016,26(2):89-91
[8]A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications.IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS.2015,25(8):493-495
[9]Parasitic Inductance of Non-Uniform Through-Silicon Vias (TSVs) for Microwave Applications.IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS.2015,25(7):424-426
[10]Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits.CHINESE PHYSICS B.2016,25(11)

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