Hits:
Title of Paper:电子芯片弹热制冷式热控系统的数值模拟
Journal:制冷学报
First Author:赵志明,刘奇,蒋翔俊*
Indexed by:国内刊物
Discipline:Engineering
First-Level Discipline:Mechanical Engineering
Document Type:J
Translation or Not:no
Date of Publication:2024-02-23
Pre One:Three-dimensional fluid-thermal–mechanical coupling numerical modeling of elastocaloric cooler for electronic chip
Next One:Topology optimization structure design of shape memory alloy with multiple constraints