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一种基片集成波导SIW的背腔缝隙圆极化毫米波天线

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Affilication of Author(s):100200

First Author:洪涛

Type of Patent:Utility models

State of Patent:Authorized patents

Application Number:CN201920943922.4

Authorization number:CN209843960U

Service Invention or Not:no

Application Date:2019-06-21

Authorization Date:2019-12-24

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