Hits:
Affilication of Author(s):100200
First Author:洪涛
Type of Patent:Invent
State of Patent:Authorized patents
Application Number:CN201811034563.7
Service Invention or Not:no
Application Date:2018-09-06
Authorization Date:2020-10-09
Pre One:一种基片集成波导SIW的背腔缝隙圆极化毫米波天线
Next One:XXXXXX