Personal Information:
Associate professor
Scientific Research
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- The effect of electric-thermal-vibration stress coupling on the reliability of Sn-Ag-Cu solder joints, Journal of Electronic Materials.Journal of Electronic Materials.2021,51:284-294
- Reliability simulation and life prediction of TSV under a thermoelectric coupling field in a 3D integrated circuit.Journal of Electronic Materials.2021,50(6):3592-3602
- The spatial and energy distribution of oxide trap responsible for 1/f noise in 4H-SiC MOSFETs.Journal of Physics Communications.2021,5(3):035002
- 基于1/f噪声表征研究非晶硅薄膜太阳电池的光致退化机理.太阳能学报.2021,42(5):230-233
- 基于GR噪声的太阳电池缺陷表征研究.太阳能学报.2021,42(3):319-322
- Reliability simulation and life prediction of Sn63Pb37 BGA solder joint under thermal cycling load.2020 China Semiconductor Technology International Conference(CSTIC 2020).2020
- 多应力耦合下电子设备可靠性建模分析与评估技术, Other research projects-2020/12/31, 已结题
- 噪声用于表征InxGa1-xAs鳍式场效应晶体管缺陷性质的研究, Other projects-2019/12/31, 已结题
- 多晶硅太阳能光伏材料及器件中缺陷的多噪声参量联合表征研究, National Natural Science Foundation of China (NSFC)-2014/12/31, 已结题
- 基于噪声检测的多晶硅太阳能光伏材料缺陷表征及应用研究, Other projects-2013/09/01, 已结题
- 介观尺度材料特性与服役行为表征的基础研究, The 973 Program-2014/12/31, 已结题
- 基于***的电子材料抗辐射能力表征技术, Other research projects-2010/12/31, 已结题
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