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Affilication of Author(s):西安电子科技大学

Disigner of the Invention:郭晶晶，高华敏，刘志全，黄斐然，魏林锋

Type of Patent:Invent

State of Patent:Pending patent

Application Number:202110851751.4

Service Invention or Not:yes

Application Date:2021-07-27