Hits:
Affilication of Author(s):微电子学院
First Author:guangbao shan
Type of Patent:发明
Application Number:CN202310460231.X
Authorization number:CN202310460231.X
Service Invention or Not:no
Authorization Date:2023-04-26
Pre One:一种面向三维集成电路无冗余TSV的编码分级修复方法
Next One:基于无网格伽辽金法的三维集成微系统电热协同计算方法