Hits:
Affilication of Author(s):微电子学院
First Author:guangbao shan
Type of Patent:发明
Application Number:CN202210474339.X
Authorization number:CN202210474339.X
Service Invention or Not:no
Authorization Date:2022-04-29
Pre One:一种基于失效物理的电子元器件可靠性模型构建方法
Next One:基于无网格伽辽金法的三维集成微系统电热协同计算方法