Current position: Home >> Scientific Research >> Patents

一种基于通硅电容可配置的三维均衡器及其参数设计方法

Hits:

Affilication of Author(s):微电子学院

Patent Coverage:国内

First Author:guangbao shan

Type of Patent:发明

Application Number:CN202110396726.1

Authorization number:CN202110396726.1

Number of Inventors:6

Service Invention or Not:no

Application Date:2021-04-13

Authorization Date:2023-02-21

Pre One:一种大面阵高帧频高可靠小型化图像传感器的三维集成电路结构

Next One:可重构的三维集成芯片结构

Baidu
map