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一种晶圆级可重构Chiplet集成结构的制备方法

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Affilication of Author(s):微电子学院

Patent Coverage:国内

First Author:guangbao shan

Type of Patent:发明

Application Number:CN202210093602.0

Authorization number:CN202210093602.0

Number of Inventors:7

Service Invention or Not:no

Application Date:2022-01-26

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