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用于封装后硅通孔叠层芯片的测试结构

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Affilication of Author(s):微电子学院

Patent Coverage:国内

First Author:guangbao shan

Type of Patent:发明

Application Number:CN202110288798.4

Authorization number:CN202110288798.4

Number of Inventors:6

Service Invention or Not:no

Application Date:2021-03-18

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