集成FEM和ANFIS的硅通孔阵列峰值温度快速预测方法及系统
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Affilication of Author(s):微电子学院
Patent Coverage:国内
Type of Patent:发明
Application Number:CN202111120059.0
Authorization number:CN202111120059.0
Service Invention or Not:no
Authorization Date:2021-09-24
Hits:
Affilication of Author(s):微电子学院
Patent Coverage:国内
Type of Patent:发明
Application Number:CN202111120059.0
Authorization number:CN202111120059.0
Service Invention or Not:no
Authorization Date:2021-09-24