Personal Information:
Researcher
Scientific Research
- No content
- High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling.IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
- Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints.IEEE TRANSACTIONS ON ELECTRON DEVICES
- 单光宝.Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems.MICROMACHINES
- Design of Spectrum Processing Chiplet Based on FFT Algorithm.MICROMACHINES
- 单光宝.Thermodynamic Multi-Field Coupling Optimization of Microsystem Based on Artificial Intelligence.MICROMACHINES
- A brief review of FEM simulation techniques for IC packaging under impact load.2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
- No content
- No content