Personal Information:
Researcher
Paper Publications
- [1]High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling.IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
- [2]Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints.IEEE TRANSACTIONS ON ELECTRON DEVICES
- [3]Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems.MICROMACHINES
- [4]Design of Spectrum Processing Chiplet Based on FFT Algorithm.MICROMACHINES
- [5]Thermodynamic Multi-Field Coupling Optimization of Microsystem Based on Artificial Intelligence.MICROMACHINES
- [6]A brief review of FEM simulation techniques for IC packaging under impact load.2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
- [7]Impact reliability analysis of a rigid-flex PCB system under acceleration loads.MICROELECTRONICS RELIABILITY
- [8]A Fast Analysis Method of Multiphysics Coupling for 3-D Microsystem.IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
- [9]Wideband compact power amplifier based on novel spatial power combining technique formillimeter-waveapplications.MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
- [10]Architecture of Computing System based on Chiplet.MICROMACHINES