Personal Information:
Researcher
Paper Publications
- [11]Recent Development and Perspectives of Optimization Design Methods for Piezoelectric Ultrasonic Transducers.MICROMACHINES
- [12]An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias.MICROMACHINES
- [13]Through-Silicon Capacitor Interconnection for High-Frequency 3-D Microsystem.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
- [14]3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
- [15]An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias.Micromachines