Thermodynamic Multi-field Coupling Optimization of Microsystem Based on Artificial Intelligence
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Title of Paper:Thermodynamic Multi-field Coupling Optimization of Microsystem Based on Artificial Intelligence
Journal:Micromachines
First Author:guangbao shan,guangbao shan,guangbao shan
Indexed by:国际刊物
Correspondence Author:guangbao shan,guangbao shan
Volume:14
Issue:2
Translation or Not:no
Date of Publication:2023-02-01