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基于机电热三场耦合的电子设备机箱结构优化设计方法

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Affilication of Author(s):100400

Teaching and Research Group:1104

Patent Coverage:2

First Author:Baoyan Duan

Type of Patent:1

Application Number:8744824

Number of Inventors:1

Service Invention or Not:no

Authorization Date:2014-06-03

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