Hits:
Affilication of Author(s):西安电子科技大学
School Sign:第一
First Author:陈志强
Disigner of the Invention:田文超,辛菲,徐瀚洋
Type of Patent:Invent
State of Patent:Pending patent
Application Number:202211417870X
Number of Inventors:4
Service Invention or Not:no
Application Date:2022-11-11
Publication Date:2023-05-17