Current position: Home>> Scientific Research>> Patents

三维封装相变散热装置

Hits:

First Author:辛菲

Disigner of the Invention:田文超,Chen Zhiqiang,陈勇,冯学贵

Type of Patent:Invent

State of Patent:Pending patent

Authorization number:ZL113421864B

Number of Inventors:5

Service Invention or Not:no

Application Date:2021-10-01

Authorization Date:2023-11-01

Pre One:基于压电陶瓷薄膜驱动的液滴射频微机电系统开关

Baidu
map