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Title of Paper:Effect of the reflow process on IMC growth for different devices and complex components

Journal:Smart Materials and Structures

First Author:Hao Cui, Wenchao Tian, Xutao Zhao, Zhiqiang Chen

Indexed by:Journal paper

Discipline:Engineering

First-Level Discipline:Mechanical Engineering

Document Type:J

Volume:31

Issue:11

Page Number:115028

Translation or Not:no

Date of Publication:2022-10-19