Profile:

Dongdong Chen, IEEE member, received his Ph. D degree in mechanical engineering from Central South University in 2018. He is an associate professor (HUASHAN Scholar) within the School of Microelectronics at Xidian University. His current research interests include the ultrasonic transducer, UWB communication, design and fabrication of microsystem, intelligent optimization algorithms and its applications.

Dongdong Chen has presided 7 projects, including National Natural Science Foundations of China, Youth Talent Fund of Joint Fund of The Ministry of Education, provincial and enterprise projects, etc. He also participated in the National Basic Research Program of China and National Natural Science Foundations of China, etc. He has published more than 70 SCI papers in Nano Energy, Composite Structures, Advanced Functional Materials, IEEE TIM, IEEE TUFFC, IEEE TBME, IEEE EDL, IEEE TCAD, IEEE SENS J, IEEE VLSI, Applied Mathematical Modelling, Applied Physics letter, Materials and Design, etc. Two papers were selected as ESI top 1% cited papers, and one paper was selected as the cover paper. His published papers have been cited more than 1200 times. In addition, he has applied/authorized 30 national invention patents.

Dongdong Chen is the Editorial Board Members of ‘Current Materials Science’ and ‘Current Mechanics and Advanced Materials’, the Guest Editors of ‘Micromachines’ and ‘Symmetry’, and the Procedure Committee Member of International Conference ISCS2022. He has won the Outstanding Paper Award of the 13th Chinese Academic Conference on Graphics and Image Analysis, the First Prize of the President's Scholarship for Top Doctoral Students of Central South University, and the Outstanding Review Award of Applied Soft Computing, etc. He has servered as the reviewer for Applied Soft Computing, Applied Mathematical Modelling, International Journal of Production Research, IEEE Journal of Biomedical and Health Informatics, etc.