1

QUAN Yi

Lecturer

Piezoelectric materials;

Ultrasonic transducers

quanyi@xidian.edu.cn

2

ZHAO Xue

Lecturer

Novel semiconductor materials and devices

zhaoxue@xidian.edu.cn

3

ZHENG Xuefeng

Professor

GaN devices and chips;

Reliability of semiconductor devices

xfzheng@mail.xidian.edu.cn

4

ZHANG Junqin

Associate Professor

3D integrated circuits and microsystems

zhangjq@mail.xidian.edu.cn

5

LIU Lianxi

Professor

Analog/mixed-signal integrated circuit design and signal process;

CMOS power electronics;

Integrated energy harvester interface design;

Low power analog front end for sensors

lxliu@mail.xidian.edu.cn

6

LIU Yang

Associate professor

Single photon avalanche diode;

Intelligent photoelectric detector;

Optoelectronic integrated circuits and systems

liuyang@xidian.edu.cn

7

LIANG Yuhua

Associate Professor

High performance integrated analog circuit;

High performance analog-to-digital converter

yhliang@xidian.edu.cn

8

LIU Yizhong

lecturer

VLSI architecture for video coding;

Signal processing and parallel computations

yzliu@xidian.edu.cn

9

LU Hongliang

Professor

Semiconductor devices and circuits co- optimization;

Mili- meter wave circuits design;

Reliability- aware design of IC

hllv@mail.xidian.edu.cn

10

DUAN Baoxing

Professor

Design and integration technology of power semiconductor devices;

New design technology for power semiconductor devices;

Key design technology for post-Moore era semiconductor devices

bxduan@xidian.edu.cn

11

LIU Hongxia

Professor

Novel Micro/nano-meter semiconductor devices and reliability;

Wide-band gap semiconductor materials and devices;

Integrated circuit design and SOC;

Brain like chip

hxliu@mail.xidian.edu.cn

12

ZHANG Ji

Lecturer

ASIC design;

SPIC design

anj@mail.xidian.edu.cn

13

LIU Chen

Associate Professor

Implantable device functional and packaging materials;

Flexible neural electrode devices;

High-performance silicon nanomembrane based thin film transistors;

High-k dielectric/High-μ semiconductor; Heterogeneous Structure

liuchen@xidian.edu.cn

14

WANG Yuehu

Associate Professor

Semiconductor device design;

Wide band-gap semiconductor materials

wangyh@mail.xidian.edu.cn

15

ZHU Jiejie

Professor

GaN mm-wave devices and ICs

jjzhu@mail.xidian.edu.cn

16

SU Jie

Associate Professor

New semiconductor devices and interface physics;

Preparation and simulation of low - dimensional materials and wide bandgap materials

sujie@xidian.edu.cn

17

FEI Chunlong

Associate Professor

Integrated ultrasonic devices and systems

clfei@xidian.edu.cn

18

PENG Yue

Associate Professor

Novel HfO2-based ferroelectric materials with high performance;

Novel HfO2-based ferroelectric non-volatile memory and array chip;

Novel ferroelectric-like memory and the application in memory-in computing;

Artificial intelligent devices; Algorithm architectures and chips

ypeng@xidian.edu.cn

19

YANG Ling

Professor

GaN electronics: device physics, processing technologies, device-circuit, device modeling, etc;

Device technologies and design of GaN mixed-signal integrated circuits and rf MMIC;

Novel semiconductor devices for logic and high-frequency applications

yangling@xidian.edu.cn

20

LIU Xiaoxian

Associate professor

Radio frequency integrated circuits and systems;

Three dimensional radio frequency microsystem

liudou@xidian.edu.cn

21

FENG Lichen

Lecturer

Artificial intelligent chip;

Neuromorphic computing;

Analog computing;

Near sensor intelligence

lcfeng@xidian.edu.cn

22

FENG Ting

Lecturer

Three-dimensional substrate integrated circuits design;

RF integrated circuits design

fengting@xidian.edu.cn

23

YANG Lin-An

Professor

Millimeter wave / terahertz Deivce technology;

Wide bandgap semiconductor materials and devices

layang@xidian.edu.cn

24

JIA Hujun

Professor

Design of new microwave power devices and circuits for high energy efficiency;

Technology for new nanometer materials and sensors

hjjia@mail.xidian.edu.cn

25

LIU Li

Associate Professor

SiC power device design and its application

liuli@mail.xidian.edu.cn

26

YIN Xiangkun

Associate Research Fellow

RF/microwave integrated system;

RF/microwave integrated passive device;

Three dimensional integrated circuit (3D IC);

Through silicon via (TSV）

yinxkcn@xidian.edu.cn