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School of Mechano-Electronic Engineering Held a Symposium on "My Journey of Chips"

Click:Time:December 3, 2020

The School of Mechano-Electronic Engineering held a symposium on "My Journey of Chips" at Room 433, Building Bin South Campus on the afternoon of September 28, in order to thoroughly implement General Secretary Xi Jinping's spirit put forward at the national college and university ideological and political work conference, adhere to fostering virtue through education, achieve the three-full education, help students establish a correct outlook on employment and perform the career planning of college students. At the conference, Jiecheng Liao (the General Manager of Payton Technology) was invited as the main speaker to talk about his "chip" journey; Li Zhang (the person in charge of the Packaging Research and Development Department of Payton Technology) and Dichun Liu (the packaging engineer of Payton Technology and outstanding graduate of Xidian University) respectively delivered keynote speeches onChip Technology and Chip FutureandInteresting Stories between Payton and Me. The conference was hosted by the teacher Hongwei Gao and nearly 200 students from the School of Mechano-Electronic Engineering participated in the conference.

The person in charge of Payton Technology introduced that Payton Technology fulfilled its industry responsibilities and promoted the development of China's chip industry from an international perspective and based on international standards. Simultaneously, the person in charge introduced Payton Technology and its future development planning from many aspects such as campus recruitment, talent training system and corporate culture.

Jiecheng Liao (the General Manager of Payton Technology, a high-end internal memory packaging and testing company in China) talked about his work experience and development history with the theme of "My Journey of Chips". Jiecheng Liao talked about the chip industry in the world firstly and then the chip industry in China, summed up the extensity and importance of the development space of the chip industry in China, and shared his entrepreneurship period with students starting from the reason why he wanted to create such a technology company at the very beginning and through the industry environment analysis and strategic adjustments and thought changes when facing difficulties.

Li Zhang (the person in charge of Packaging Research and Development Department of Payton Technology) showed the students the key technologies and new technologies of Payton Technology, and also introduced the distribution and application of storage chips, sub-packaging design and production process and the future development direction of related technologies to them. When speaking, Li Zhang also activelyasked students many questions and interactedwith them enthusiastically, while the students responded to him positively and expressed their understanding and opinions, and after the conference, they consulted with experts about professional and company-related issues, and the atmosphere was harmonious on site.

Dichun Liu (the packaging engineer of Payton Technology and outstanding graduate of Xidian University) shared and exchanged with the students. Dichun Liu introduced his work experience and feeling in Payton Technology this year firstly, and also shared some of his experience in employment, career selection and career planning after entering the company with students.

The students who participated in the report said that they were greatly benefited from the report, which can help them better perform their career planning, and play a very strong guiding role in their future job hunting and entrepreneurship, and so on. As mentioned in the report: "With taking dreams as impetus, living the day to the fullest and living for the times", the participants could take this as an opportunity to find self-realization values and goals and bravely shoulder the mission of the times.

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